Bookcover of Power and Thermal Management in Multicores
Booktitle:

Power and Thermal Management in Multicores

Preparing microprocessors for the Dark Silicon era

LAP LAMBERT Academic Publishing (2012-04-04 )

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ISBN-13:

978-3-8484-3456-5

ISBN-10:
3848434563
EAN:
9783848434565
Book language:
English
Blurb/Shorttext:
Thermal and power related issues are common in most modern microprocessors. We are not only talking about servers, but also mobile devices, desktop computers, laptop, GPUs, APUs, etc. For many years microprocessor design has been (and is) limited by power dissipation and temperature. Many studies refer to these key factors as the "Power Wall". Even today, this "Power Wall" is still limiting the number of cores that can be placed on the same die. In this project we worked in the design, implementation and testing of microarchitecture techniques for accurately adapting the processor performance to power constraints in the single core scenario, multi-core scenario and 3D die-stacked core scenario. We first introduce "Power-Tokens", to approximate the power being consumed by the processor in real time. Later we will discuss different mechanisms based on pipeline throttling, confidence estimation, instruction criticality information, to adapt the processor to a predefined power budget.
Publishing house:
LAP LAMBERT Academic Publishing
Website:
https://www.lap-publishing.com/
By (author) :
Juan M. Cebrián, Juan L. Aragón, Stefanos Kaxiras
Number of pages:
188
Published on:
2012-04-04
Stock:
Available
Category:
Hardware
Price:
68.00 €
Keywords:
energy efficiency, Power Dissipation, Energy Consumption, Power budget, leakage power, dynamic power

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