Buchcover von Plasma-processing-induced Damage Of Thin Dielectric Films
Buchtitel:

Plasma-processing-induced Damage Of Thin Dielectric Films

LAP LAMBERT Academic Publishing (30.11.2012 )

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ISBN-13:

978-3-8433-8758-3

ISBN-10:
3843387583
EAN:
9783843387583
Buchsprache:
Englisch
Klappentext:
In semiconductor industry, material property degradation due to process is a critical factor that limits the device performance. Process-induced damage on a variety of dielectric materials is discussed and measured. Results from various metrologies are packaged and correlated into systematic theory. Charge-induced, chemical, and physical damage source in plasma process environment is identified and optimized. Two sample types of dielectrics are investigated: high-k dielectrics used in device technology and low-k dielectrics as observed in interconnect technology.
Verlag:
LAP LAMBERT Academic Publishing
Webseite:
https://www.lap-publishing.com/
von (Autor):
He Ren
Seitenanzahl:
188
Veröffentlicht am:
30.11.2012
Lagerbestand:
Lieferbar
Kategorie:
Technik
Preis:
68,00 €
Stichworte:
Dielectric Material, Plasma Process, Process-induced Damage, Interconnect Technology

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