will help in Bioremediation
LAP LAMBERT Academic Publishing (12.06.2012) - ISBN-13: 978-3-659-14538-4
Determination of bioremediaiton potential of copper resistant mesophilles isolated from tannery industry effluent
LAP LAMBERT Academic Publishing (23.05.2012) - ISBN-13: 978-3-659-13440-1
LAP LAMBERT Academic Publishing (03.06.2016) - ISBN-13: 978-3-659-89618-7
Copper, KBS-3, Cryogenics, Ductility, Electrical resistivity and conductivity
Soph Press (04.01.2012) - ISBN-13: 978-613-9-20303-1
Dietary supplement, Copper
Fidel (15.05.2012) - ISBN-13: 978-613-6-87569-9
Copper-copper(II) sulfate electrode, Coulometry, Buffer solution, Copper(II) sulfate, Solvation
Duct Publishing (01.03.2012) - ISBN-13: 978-620-0-79042-2
Investigation of Copper Resistivity in Nanometric Dimensions for Application as Interconnects in Integrated Circuits
LAP LAMBERT Academic Publishing (17.06.2013) - ISBN-13: 978-3-659-41161-8
Simulation and Measurement of Nanometer-Scale Resistivity of Copper Films for Interconnect Applications
VDM Verlag Dr. Müller (26.06.2009) - ISBN-13: 978-3-639-16770-2
Alphascript Publishing (04.10.2010) - ISBN-13: 978-613-2-90741-7
Copper, Electrical wiring, Electromagnet
Chrono Press (07.07.2012) - ISBN-13: 978-620-1-31325-5
Overall Productivity increased when Casting Production is shifted from Green Sand Mould Process to Shell Mould Process
LAP LAMBERT Academic Publishing (12.12.2014) - ISBN-13: 978-3-659-64569-3
Selective deposition metallic copper on silicon wafer and copper oxides deposited on fiberglass
LAP LAMBERT Academic Publishing (15.08.2012) - ISBN-13: 978-3-659-19982-0
Why Earthquake-Resistant Structures?
Scholars' Press (27.02.2020) - ISBN-13: 978-613-8-92426-5
Alphascript Publishing (25.07.2011) - ISBN-13: 978-613-0-00393-7
High Copper Amalgam Alloys
LAP LAMBERT Academic Publishing (04.05.2012) - ISBN-13: 978-3-659-11212-6
Acid resistance coli forms in food
LAP LAMBERT Academic Publishing (26.07.2012) - ISBN-13: 978-3-659-18073-6
Passwort vergessen?
